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Kunshan Zhicheng single wafer cleaning machine
11-06
Single Wafer Cleaner
The semiconductor cleaning process is divided into dry process and wet process, and the wet process includes tank cleaning, single wafer cleaning, etc. With the development of semiconductor technology, the width of gate bars has entered the 3nm level. Traditional tank cleaning can no longer meet the requirements of high-precision cleaning process. Compared with tank cleaning, single wafer cleaning equipment has been favored by the market due to its better cleaning effect
The single-chip cleaning machine is a piece-by-piece rotary spray cleaning equipment, which is a variant of immersion cleaning. The system generally includes an automatic liquid distribution system, a cleaning chamber, and a waste liquid recovery system
Spray cleaning completes chemical cleaning, deionized water rinsing, spin drying and other processes at one time in a sealed working chamber, which reduces the influence caused by human operation factors in each cleaning process. In the spray cleaning, due to the effect of rotation and spraying, the solution on the surface of the silicon wafer is more uniform. At the same time, the solution that touches the surface of the silicon wafer is always fresh, so that the silicon wafer can be precisely controlled by setting the process time. Excellent cleaning and corrosion effect, achieving very good consistency. The sealed working chamber can isolate the volatilization of chemical liquid, reduce the loss of solution and the harm of solution vapor to human body and environment. Each system is stored in different chemical reagents, and they are mixed before they reach the nozzle when they are used to keep them fresh to maximize their potential, so that they will react the fastest when cleaning
As shown in the figure above, the cavity structure of the single-chip cleaning machine includes: liquid medicine cleaning arm, cleaning and drying arm, rescue arm, recovery transmission module, exhaust, and wafer fixing module.
Zhicheng Automation Equipment Co., Ltd. has successfully developed a single-chip cleaning machine with 2/4/8/16 chambers, which can be applied to cleaning 8-inch/12-inch silicon wafers according to customer needs. It has good cleaning effect, fast speed, and production High efficiency, low energy consumption, and low after-sales maintenance costs.