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Wet Bench

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Wet Bench

  • Description
  • Applications: RCA cleaning, PR wet strip, Dielectric layer wet etch, Metal layer wet etch,furnace pre-cleaning et al.
    Tool type: cassette type & cassette-less type.
    Wafer size: 100 mm~300 mm
    Features & configurations:
    Supporting C.C.S.S and L.C.S.S.
    Marangoni dry or spin dry
    Auto dosing, bleed&feed
    Heating control, concentration control,flow rate control, pressure control et al.
    Bath overheating protection, leak sensors configuration
    Chemistry reclaim
    SECS/GEM communication
    Process Specification:
    non-uniformity : WiW ≤4; WtW≤4%;RtR≤4%
    Particle adders: PA<30ea@0.09um (SiO2 wafer with incoming particle count <50ea)
    Metal contamination: <5E9 atoms/cm2

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