
PRODUCTS
Wet Bench
- Description
-
Applications: RCA cleaning, PR wet strip, Dielectric layer wet etch, Metal layer wet etch,furnace pre-cleaning et al.
Tool type: cassette type & cassette-less type.
Wafer size: 100 mm~300 mm
Features & configurations:
Supporting C.C.S.S and L.C.S.S.
Marangoni dry or spin dry
Auto dosing, bleed&feed
Heating control, concentration control,flow rate control, pressure control et al.
Bath overheating protection, leak sensors configuration
Chemistry reclaim
SECS/GEM communication
Process Specification:
non-uniformity : WiW ≤4; WtW≤4%;RtR≤4%
Particle adders: PA<30ea@0.09um (SiO2 wafer with incoming particle count <50ea)
Metal contamination: <5E9 atoms/cm2
Category:
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