
PRODUCTS
Single Wafer Cleaner
- Description
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Applications: RCA cleaning, pre-deposition cleaning, post-etch cleaning, post-CMP cleaning,wet etch, pre-EPI cleaning et al.
Wafer size: 100 mm ~ 300 mm
Features & configurations:
4~16 chambers, supporting customization
2~4 MIF/FOUP
Supporting chemistry C.C.S.S. and L.C.S.S.
Heating control, concentration control, flow rate control, pressure control et al.
Separated exhaust for acid, base and organics
Chemistry reclaim
High-definition camera, E-flow (option)
SECS/GEM communication
Process Specification:
Etch non-uniformity: WiW≤3%;WtW≤3%;RtR≤3%
Particle adders: PA<20ea@0.09um (SiO2 wafer with incoming particle count <50ea)
Metal contamination: <5E9 atoms/cm2
Category:
Products
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