Applications: Pillar, Bump, RDL, TSV et al.
Wafer size: 150mm&200mm&300mm
Features & configurations:
Maximum of 3 load ports
Maximum of 24 plating chambers: Cu, Ni, Sn/Ag, Au
Maximum of 4 pre-wet chambers, 4 SRD chambers
Fountain type plating cell design, no cross contamination risk
Module PM design, high tool uptime
Rubber seal technology, good seal performance
Catholyte/anolyte separation technology, good solution stability
Non-uniformity: WiW ≤ 5%, WtW ≤5%, RtR ≤5%.