PRODUCTS
Electroplating tool
- Description
-
Applications: Pillar, Bump, RDL, TSV et al.
Wafer size: 150mm&200mm&300mm
Features & configurations:
Maximum of 3 load ports
Maximum of 24 plating chambers: Cu, Ni, Sn/Ag, Au
Maximum of 4 pre-wet chambers, 4 SRD chambers
Fountain type plating cell design, no cross contamination risk
Module PM design, high tool uptime
Rubber seal technology, good seal performance
Catholyte/anolyte separation technology, good solution stabilityProcess specifications:
Non-uniformity: WiW ≤ 5%, WtW ≤5%, RtR ≤5%.
Category:
Products
Contact us
Address: No. 889 Zhonghua Road, Bacheng Town, Kunshan City,
Jiangsu Province, China
Customer service hotline：
0512-57762325 0512-55239392
Fax：0512-55239392
Website：www.kszcauto.cn
E-mail：zcauto@yeah.net
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