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Electroplating tool

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Electroplating tool

  • Description

  • Applications: Pillar, Bump, RDL, TSV et al.
    Wafer size: 150mm&200mm&300mm
    Features & configurations:
    Maximum of 3 load ports
    Maximum of 8 plating chambers: Cu, Ni, Sn/Ag, Au
    Maximum of 8 chemistry reservoirs
    Maximum of 2 pre-wet chambers,2 SRD chambers
    Fountain type plating cell design, no cross contamination risk
    Single chamber PM design, high tool uptime
    Rubber seal technology, good seal performance
    Catholyte/anolyte separation technology, good solution stability

    Process specifications:
    Non-uniformity: WiW ≤ 5%, WtW ≤5%, RtR ≤5%.

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