
PRODUCTS
Spin Scrubber
- Description
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Applications: wafer fabrication and advanced packaging
Wafer size: 100 mm~ 300 mm
Features & configurations:
2~4 load ports
4~8 cleaning chambers
Wafer flip function, front size and back side cleaning in sequence
Configured with back side and edge scrubber
N2 atomizing two-fluid cleaningProcess specifications:
PA ≤20ea@0.09μm
PRE ≥97%@0.09μm
metal contamination ≤5E9 atoms/cm2
Category:
Products