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Coater & Developer

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Coater & Developer

  • Description
  • Applications: advanced packaging, compound semiconductor fabrication et al.
    Wafer size: 100 mm~200 mm
    Features & configurations:
    Maximum spin RPM of 5,000 for coater, maximum acceleration of 30,000 RPM/s
    Photoresist dispensing accuracy of +/-0.1 mL, heat preserved nozzle
    Constant temperature water bath for temperature control, developer solution temperature of 23 +/-0.5 oC
    Photoresist edge etch ratio ≥99.99%, accuracy up to 0.1 um
    Enabled with backside cleaning function 
    Process Specification:
    PR thickness non-uniformity : WiW≤2%;WtW≤2%;RtR≤3%

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