
PRODUCTS
Coater & Developer
- Description
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Applications: advanced packaging, compound semiconductor fabrication et al.
Wafer size: 100 mm~200 mm
Features & configurations:
Maximum spin RPM of 5,000 for coater, maximum acceleration of 30,000 RPM/s
Photoresist dispensing accuracy of +/-0.1 mL, heat preserved nozzle
Constant temperature water bath for temperature control, developer solution temperature of 23 +/-0.5 oC
Photoresist edge etch ratio ≥99.99%, accuracy up to 0.1 um
Enabled with backside cleaning function
Process Specification:
PR thickness non-uniformity : WiW≤2%;WtW≤2%;RtR≤3%
Category:
Products